Survey on chiplets: interface, interconnect and integration methodology

Design of ion-implanted MOSFET's with very small physical dimensions

R.H. Dennard, F.H. Gaensslen, Hwa-Nien Yu et al. · IEEE Journal of Solid-State Circuits · 1974 · 3.4K citations

Engineering, Vlsi Design, Integrated Circuits +16

Cramming more components onto integrated circuits, Reprinted from Electronics, volume 38, number 8, April 19, 1965, pp.114 ff.

Gordon E. Moore · IEEE Solid-State Circuits Society Newsletter · 2006 · 736 citations

Engineering, April 1965, Electronic Design Automation +18

Cost-size optima of monolithic integrated circuits

B.T. Murphy · Proceedings of the IEEE · 1964 · 387 citations

Engineering, Vlsi Design, Cost-size Optima +18

Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect

Ravi Mahajan, Robert Sankman, Neha Patel et al. · 2016 · 344 citations

Emib Assembly Process, Engineering, Device Integration +16

Enabling interposer-based disintegration of multi-core processors

Ajaykumar Kannan, Natalie Enright Jerger, Gabriel H. Loh · 2015 · 166 citations

Hardware Security, Interposer-based Disintegration, Multiple Stacks +15