A Finite Element Analysis on the Reliability of Heavy Bonding Wire for High-Power IGBT Module

Abstract

Several methods that could effectively increase the strength of heavy aluminum bonding wire and broaden the scope for high-power IGBT module applications with a high degree of integration have been proposed. In this work, a series of finite element analysis has been carried out to study the thermomechanical reliability of bonding wire/ribbon under different conditions. The effects of structural loop parameters, bonding wire materials, bonding ribbon, and polymer coating are discussed based on simulation results, and the primary cause for the effect of geometric parameters has been developed. It is worth noticing that the reliability of the heavy bonding wires increases with the increase in Young's modulus and Poisson's rate in a polymer coating. This present study provides new insights into the thermomechanical behaviors of heavy bonding wire/ribbon, as well as a practical guide for designing an optimal structural loop shape and selecting an appropriate material of bonding wires or polymer, which will accelerate functional applications in industries.