Achieving microstructure refinement and superior mechanical performance of Sn-2.0Ag-0.5Cu-2.0Zn (SACZ) solder alloy with rotary magnetic field

Properties of lead-free solder alloys with rare earth element additions

Chi‐Man Lawrence Wu, Daquan Yu, C. Law et al. · Materials Science and Engineering R Reports · 2004 · 587 citations

Natural Sciences, Materials Engineering, Materials Science +10

Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys

K.S Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Materials Science and Engineering A · 2002 · 378 citations

Natural Sciences, Materials Engineering, Materials Science +11

Tensile properties of Sn–Ag based lead-free solders and strain rate sensitivity

Ikuo Shohji, Tomohiro Yoshida, Takehiko Takahashi et al. · Materials Science and Engineering A · 2003 · 198 citations

Natural Sciences, Materials Engineering, Materials Science +17

Effect of alloying elements on properties and microstructures of SnAgCu solders

Lili Gao, Songbai Xue, Liang Zhang et al. · Microelectronic Engineering · 2010 · 160 citations

Natural Sciences, Materials Engineering, Materials Science +12

Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy

Xu Shi, Wei Zhou, J.H.L. Pang et al. · Journal of Electronic Packaging · 1999 · 153 citations

Natural Sciences, Materials Engineering, Materials Science +13