Concepedia

Mechanism of ultrasonic-assisted transient liquid phase bonding of 6061 Al alloy with cladded Zn-Al alloy in air

Qiang Jia, Zhiwei Lai, Hongqiang Zhang, Hailin Bai, Guisheng Zou, Chuan Pan, Lei Liu

Journal of Materials Processing Technology · 2020 · 24 citations · 30 references

DOI

Concepts

References

30

A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint

Isaac Tuah-Poku, M. Dollár, T. B. Massalski · Metallurgical Transactions A · 1988 · 330 citations

, , +11

Transient Liquid Phase Bonding

W. D. MacDonald, Thomas W. Eagar · Annual Review of Materials Science · 1992 · 306 citations

, , +10

Development of high-temperature solders: Review

Guang Zeng, Stuart D. McDonald, Kazuhiro Nogita · Microelectronics Reliability · 2012 · 299 citations

, , +10

Transient liquid phase bonding

William F. Gale, Daniel A. Butts · Science and Technology of Welding & Joining · 2004 · 296 citations

, , +10

Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging

C.J. Hang, Chunqing Wang, M. Mayer et al. · Microelectronics Reliability · 2007 · 244 citations

, , +13