Investigation of the Electroless Nickel Plated Sic Particles in Sac305 Solder Matrix

Tin–lead (SnPb) solder reaction in flip chip technology

K. N. Tu, Ke Zeng · Materials Science and Engineering R Reports · 2001 · 587 citations

Materials Science, Engineering, Advanced Packaging (Semiconductors) +4

Electrodeposition of Ni–SiC nano-composite coatings and evaluation of wear and corrosion resistance and electroplating characteristics

Mohammad Reza Vaezi, S.K. Sadrnezhaad, Leila Nikzad · Colloids and Surfaces A Physicochemical and Engineering Aspects · 2007 · 405 citations

Materials Engineering, Materials Science, Corrosion Protection +7

Structure and properties of lead-free solders bearing micro and nano particles

Liang Zhang, K. N. Tu · Materials Science and Engineering R Reports · 2014 · 320 citations

Materials Science, Engineering, Nanomaterials +5

Mechanical properties of nickel silicon carbide nanocomposites

Alexandra Zimmerman, G. Palumbo, K.T. Aust et al. · Materials Science and Engineering A · 2002 · 260 citations

Materials Science, Engineering, Mechanical Properties +4

Hardening effect induced by incorporation of SiC particles in nickel electrodeposits

Evangelia A. Pavlatou, M. Stroumbouli, P. Gyftou et al. · Journal of Applied Electrochemistry · 2005 · 213 citations · Full text

Materials Engineering, Materials Science, Electrical Engineering +6