Publication | Closed Access
Atomic-scale quantitative analysis of implanted Mg in annealed GaN layers on free-standing GaN substrates
26
Citations
38
References
2019
Year
Wide-bandgap SemiconductorEngineeringImplanted MgIon ImplantationMaterials ScienceElectrical EngineeringMg-implanted GanCrystalline DefectsAtomic-scale Quantitative AnalysisAluminum Gallium NitrideAnnealed Gan LayersGallium OxideStacking FaultsCategoryiii-v SemiconductorMg ClustersMicrostructureSurface ScienceApplied PhysicsGan Power Device
Achieving efficient p-type conduction in Mg-implanted GaN depends largely on postimplantation annealing conditions. Here, we study the effect of postimplantation annealing on the evolution of defects and their interactions with implanted Mg ions by using scanning transmission electron microscopy and atom probe tomography. We found that Mg clusters start to form by annealing the implanted sample above 1000 °C. In addition to the Mg clusters, stacking faults form at an annealing temperature of 1300 °C. The Mg concentrations of about 2–3 orders of magnitude higher than implanted Mg were segregated at the stacking faults. Nanobeam electron diffraction analysis revealed no distinct phase other than GaN formed at the Mg-enriched defects, suggesting that Mg is substituted for Ga in the GaN lattice at the edge of the stacking faults.
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