Ultra-low thermal expansion coefficient of PZB/β-eucryptite composite glass for MEMS packaging

Microcracking in Ceramics Induced by Thermal Expansion or Elastic Anisotropy

Viggo Tvergaard, John W. Hutchinson · Journal of the American Ceramic Society · 1988 · 739 citations

Natural Sciences, Materials Engineering, Materials Science +17

MEMS Mechanical Sensors

Steve Beeby · Sensor Review · 2004 · 469 citations

Integrating MEMS and ICs

Andreas Fischer, Fredrik Forsberg, Martin Lapisa et al. · Microsystems & Nanoengineering · 2015 · 355 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17

Glass frit bonding: an universal technology for wafer level encapsulation and packaging

Roy Knechtel · Microsystem Technologies · 2005 · 188 citations

Engineering, Materials Engineering, Materials Science +16

A low noise capacitive MEMS accelerometer with anti-spring structure

Hongcai Zhang, Xueyong Wei, Yanyu Ding et al. · Sensors and Actuators A Physical · 2019 · 85 citations

Engineering, Electrical Engineering, Mechanical Engineering +14