The pressureless sintering of micron silver paste for electrical connections

Metal–metal bonding process using Ag metallo-organic nanoparticles

Eiichi Ide, Shinji Angata, Akio Hirose et al. · Acta Materialia · 2005 · 498 citations

Natural Sciences, Materials Engineering, Materials Science +10

Mechanical properties of nano-silver joints as die attach materials

Kim S. Siow · Journal of Alloys and Compounds · 2011 · 384 citations

Natural Sciences, Materials Engineering, Materials Science +12

Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material

John G. Bai, Ziyang Zhang, Jesus N. Calata et al. · IEEE Transactions on Components and Packaging Technologies · 2006 · 370 citations

Engineering, Materials Engineering, Materials Science +17

Low-temperature low-pressure die attach with hybrid silver particle paste

Katsuaki Suganuma, S. Sakamoto, Noriko Kagami et al. · Microelectronics Reliability · 2011 · 283 citations

Natural Sciences, Materials Engineering, Materials Science +8

Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging

Jianfeng Yan, Jianfeng Yan, Guisheng Zou et al. · Scripta Materialia · 2012 · 209 citations

Natural Sciences, Materials Engineering, Materials Science +14