MRAM as Embedded Non-Volatile Memory Solution for 22FFL FinFET Technology

O. Golonzka, Juan G. Alzate, Ümüt Arslan, M. Bohr, Justin Brockman, Benjamin Buford, Christopher W. Connor, Nilanjan Das, Barry M. Doyle, T. Ghani,

2018 · 156 citations · 5 references

Concepts

Abstract

This paper presents key features of MRAM-based non-volatile memory embedded into Intel 22FFL technology. 22FFL is a high performance, ultra low power FinFET technology for mobile and RF applications with extensive high voltage and analog support, and a high level of design flexibility at low cost <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">1</sup> . Embedded NVM technology presented here achieves 200°C 10-year retention capability combined with>10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">6</sup> cycle endurance and high die yield. Technology data retention, endurance and yield capabilities are demonstrated on 7.2Mbit arrays. We describe device-level MTJ characteristics, key integration features, cell characteristics, array operation specifics, as well as key yield milestones.

References

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