IEEE Transactions on Nuclear Science · 2018 · 55 citations · 10 references
EngineeringNuclear PhysicsEnergy EfficiencyHeavy Ion StrikePower ElectronicsHeavy IonIon ImplantationHigh Voltage EngineeringHeavy Ion StrikesSic-based Power DevicesIon EmissionElectrical EngineeringPhysicsNuclear SecurityBias Temperature InstabilityPower Semiconductor DeviceSingle Event EffectsRadiation TransportHeat TransferDevice ReliabilityMicroelectronicsPower DeviceNatural SciencesApplied PhysicsSingle-event Burnout
SiC power devices have been found experimentally to burn out from heavy ion strikes with linear energy transfers as low as 2.0 MeV · cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> /mg. In this paper, to better understand the failure mechanisms, we study the single-event burnout (SEB) phenomenon using a unified physics model between heavy ion radiation transport and device response. High-fidelity radiation data, generated from a general purpose Monte Carlo N-particle transport code (MCNP6.2), were modeled using a double Gaussian function to take into account both the heavy ion and the delta ray contributions. SiC junction barrier Schottky (JBS) diodes underwent 3-D TCAD electrothermal simulations using the double Gaussian model. This model was compared against other heavy ion models to determine the behavior of the thermal response from a heavy ion strike. The results reveal that there is a more rapid thermal response from models using high-fidelity heavy ion radiation data than approximated models provided by TCAD simulators. Peak temperature results from high-voltage SiC JBS diodes, which agree with the experimental observation of SEBs in SiC power devices.
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S. Kuboyama, Chihiro Kamezawa, Naomi Ikeda et al. · IEEE Transactions on Nuclear Science · 2006 · 101 citations
Semiconductor Technology, Electrical Engineering, Engineering +12