Pt-wire bonding optimization for electroplated Pt films on γ-Al2O3 for high temperature and harsh environment applications

Review on materials, microsensors, systems and devices for high-temperature and harsh-environment applications

M. Werner, W.R. Fahrner · IEEE Transactions on Industrial Electronics · 2001 · 327 citations

Engineering, Materials Engineering, Materials Science +17

Nickel–palladium bond pads for copper wire bonding

Horst Clauberg, Petra Backus, Bob Chylak · Microelectronics Reliability · 2010 · 72 citations

Natural Sciences, Materials Engineering, Materials Science +10

Development of Nickel Wire Bonding for High-Temperature Packaging of SiC Devices

Ravi K. Burla, Li Chen, Christian A. Zorman et al. · IEEE Transactions on Advanced Packaging · 2009 · 27 citations

Natural Sciences, Materials Engineering, Materials Science +16

Influence of packaging atmospheres on the durability of high-temperature SAW sensors

Jochen Bardong, Gudrun Bruckner, Martin Kraft et al. · 2009 · 26 citations

Engineering, Materials Engineering, Materials Science +17

Effect of Chromium–Gold and Titanium–Titanium Nitride–Platinum–Gold Metallization on Wire/Ribbon Bondability

Jianbiao Pan, Robert M. Pafchek, Frank F. Judd et al. · IEEE Transactions on Advanced Packaging · 2006 · 25 citations

Natural Sciences, Materials Engineering, Materials Science +16