Photoluminescence Imaging for Buried Defects Detection in Silicon: Assessment and Use-Cases

Abstract

In this paper, the innovative photoluminescence imaging technique is described for applications to buried defect detection in silicon devices. The validity of this emerging technique is first assessed in comparison with well-established characterization techniques (defect selective etching of silicon, X-Ray diffraction topography, cross-sectional transmission electron microscopy imaging and photoluminescence spectroscopy). This paper then describes specific applications illustrating the use of the photoluminescence imaging technique for common processes of the CMOS semiconductor industry. The benefit of this fast, high resolution and non-destructive technique is demonstrated: this includes industrial use of the technique for in-line production control on product wafers.