Publication | Closed Access
Investigation of poly (1-vinyl imidazole co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole
90
Citations
34
References
2018
Year
Materials Science4-Butanediol DiglycidylChemical EngineeringElectrometallurgyEngineeringElectroactive MaterialCopper ElectroplatingConducting PolymerPolymer SciencePolymer ChemistryElectrochemistry
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