Publication | Closed Access
Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling
14
Citations
6
References
2018
Year
Unknown Venue
EngineeringVlsi DesignTransistor LevelComputer ArchitectureComputer-aided DesignSequential 3DPhysical Design (Electronics)Wafer Scale ProcessingAdvanced Packaging (Semiconductors)Parallel Computing3D Ic ArchitectureKey Integration ChallengesAdvanced Semiconductor ScalingComputer EngineeringSequential StackingMicroelectronicsTechnology ScalingApplied PhysicsSequential Device StackingThree-dimensional Integrated Circuits3D Integration
In this paper, we review the current progress on 3D sequential device stacking, highlighting the main integration challenges and the possible technological solutions. Next, we explore the potential benefits of 3D sequential stacking at transistor level, CMOS level and for hybrid circuits.
| Year | Citations | |
|---|---|---|
Page 1
Page 1