Concepedia

Thermal transient measurement and modelling of a power cycled flip-chip LED module

Lisa Mitterhuber, Stefan Defregger, Julien Magnien, J. Rosc, René Hammer, Lena Goullon, Matthias Hütter, Franz Schrank, Stefan Hörth, Elke Kraker

Microelectronics Reliability · 2017 · 15 citations · 17 references

DOI

Concepts

References

17

Selected failure mechanisms of modern power modules

Mauro Ciappa · Microelectronics Reliability · 2002 · 955 citations

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Light emitting diodes reliability review

Moon‐Hwan Chang, Diganta Das, P. V. Varde et al. · Microelectronics Reliability · 2011 · 746 citations

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Fine structure of heat flow path in semiconductor devices: A measurement and identification method

Vladimı́r Székely, Tran Van Bien · Solid-State Electronics · 1988 · 435 citations

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A new evaluation method of thermal transient measurement results

V. Székely · Microelectronics Journal · 1997 · 423 citations

Identification of RC networks by deconvolution: chances and limits

Vladimı́r Székely · IEEE Transactions on Circuits and Systems I Fundamental Theory and Applications · 1998 · 261 citations

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