J. Rosc

Advanced 3D failure characterization in multi-layered PCBs

Eva Grünwald, René Hammer, J. Rosc et al. · NDT & E International · 2016 · 21 citations

Natural Sciences, Materials Engineering, Materials Science +16

Automatized failure analysis of tungsten coated TSVs via scanning acoustic microscopy

Eva Grünwald, J. Rosc, René Hammer et al. · Microelectronics Reliability · 2016 · 20 citations

Natural Sciences, Materials Engineering, Materials Science +10

Correlative, ML-based and non-destructive 3D-analysis of intergranular fatigue cracking in SAC305-Bi solder balls

Charlotte Cui, Fereshteh Falah Chamasemani, Priya Paulachan et al. · npj Materials Degradation · 2024 · 20 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

New approaches towards the investigation on defects and failure mechanisms of insulating composites used in high voltage applications

Dietmar Lenko, Sandra Schlögl, Sabine Bichler et al. · Composites Part B Engineering · 2013 · 19 citations

Natural Sciences, Materials Engineering, Materials Science +15

Thermal transient measurement and modelling of a power cycled flip-chip LED module

Lisa Mitterhuber, Stefan Defregger, Julien Magnien et al. · Microelectronics Reliability · 2017 · 15 citations

Engineering, Computer Engineering, Electrical Engineering +14