Concepedia

Effect of conditioner load on the polishing pad surface during chemical mechanical planarization process

Cheolmin Shin, Hongyi Qin, Seok‐Jun Hong, Sanghyuk Jeon, Atul Kulkarni, Taesung Kim

Journal of Mechanical Science and Technology · 2016 · 23 citations · 22 references

Concepts

EngineeringMaterials EngineeringMaterials ScienceMaterials ProcessingSurface EngineeringSurface ScienceSurface Finish QualitySurface FinishesSurface FinishingSurface ModificationSurface PreparationSurface TreatmentChemical Mechanical PlanarizationMechanical PolishingPolishingPolishing ProcessesPolishing-induced Surface DamageSurface Polishing

References

22

Application of Chemical Mechanical Polishing to the Fabrication of VLSI Circuit Interconnections

W. Patrick, W. L. Guthrie, C. L. Standley et al. · Journal of The Electrochemical Society · 1991 · 237 citations

Engineering, Electrical Engineering, Materials Science +17

Polishing pad surface characterisation in chemical mechanical planarisation

John McGrath, Chris Davis · Journal of Materials Processing Technology · 2004 · 130 citations

Engineering, Materials Engineering, Materials Science +11

Pad conditioning in chemical mechanical polishing

Bill Hooper, Greg Byrne, S Galligan · Journal of Materials Processing Technology · 2002 · 125 citations

Engineering, Materials Engineering, Materials Science +11

Effects of pad properties on material removal in chemical mechanical polishing

K.H. Park, Hyo Ju Kim, Okkyung chang et al. · Journal of Materials Processing Technology · 2007 · 103 citations

Engineering, Materials Engineering, Materials Science +16

Optical interferometry for surface measurements of CMP pads

David J. Stein, Dale L. Hetherington, Tom Stout · Journal of Electronic Materials · 1996 · 88 citations

Engineering, Electrical Engineering, Materials Science +16