Publication | Closed Access
Overview and Emerging Challenges in Wafer Thinning Process for Handheld Applications
11
Citations
19
References
2006
Year
EngineeringMechanical EngineeringWafer Thinning ProcessHandheld ApplicationsWafer Scale ProcessingAdvanced Packaging (Semiconductors)Emerging ChallengesElectronic PackagingMaterials Science3D Ic ArchitectureFabrication TechniqueSemiconductor Device FabricationMicroelectronics3D PrintingWafer ThinningAdvanced PackagingChip-scale PackageFlexible ElectronicsMicrofabricationUltra ThinningApplied PhysicsTechnology
An overview and emerging challenges in wafer thinning process are discussed from view point of large Silicon (Si) wafer ultra thinning, bumped wafer thinning, chip strength enhancement and key enabling technology for advanced 3D packaging.
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