Charles Lee - Concepedia

Author

Charles Lee

Jet Propulsion Laboratory ORCID

Also Known As

Anh-Vu Pham, C. Lee, Charles "Skip" Lee, Charles Lee, Zonghu Han

125

Publications

965

Citations

H-Index

132

Concepts

All Affiliations

Jet Propulsion Laboratory Institute of Microelectronics Georgia Institute of Technology Infineon Technologies (Singapore)Agency for Science, Technology and Research

About

Charles Lee is an author at Jet Propulsion Laboratory specializing in engineering, materials science, and mechanical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	16	23	661
2	Education	1	1	24
3	Health Sciences	1	1	13
4	Management	1	1	25
5	Natural Sciences	1	1	51

Charles Lee

Publications

732

Citations

H-Index

Page 1

	Year	Citations
Gas diffusion layer durability under steady-state and freezing conditions Charles Lee, Walter Mérida Journal of Power Sources Materials ScienceEngineeringDiffusion ResistanceFreezing ConditionsThermal Transport	2006	117
Effect of Setting Conditions on Mineral Trioxide Aggregate Flexural Strength Mary P. Walker, Adam Diliberto, Charles Lee Journal of Endodontics Materials ScienceEngineeringStrength PropertyMineral-fluid InteractionMechanical Engineering	2006	94
Kinetics of the metastable optically induced ESR in<i>a</i>-Si:H Charles Lee, W. D. Ohlsen, P. C. Taylor, Physical review. B, Condensed matter PhotonicsEpitaxial GrowthInduced EsrEngineeringPhotoluminescence	1985	51
Study of stability of high‐temperature polyimides using TG/MS technique Wei Xie, Rebecca Heltsley, Xinhua Cai, Journal of Applied Polymer Science Materials ScienceChemical EngineeringEngineeringOnset TemperaturePolymer Stability	2001	38
Determination of time independent component of the complex modulus during cure of thermosetting systems Richard J. Farris, Charles Lee Polymer Engineering and Science EngineeringDifferential Scanning CalorimetryMechanical EngineeringExperimental ThermodynamicsImpulse Method	1983	29
Development of Fine Pitch Solder Microbumps for 3D Chip Stacking Aibin Yu, Aditya Kumar, Soon Wee Ho, EngineeringMechanical EngineeringUltra Fine PitchSi ChipIntegrated Circuits	2008	28
Process Development and Reliability of Microbumps Sharon Pei-Siang Lim, Vempati Srinivasa Rao, Wai Yin Hnin, IEEE Transactions on Components and Packaging Technologies EngineeringMechanical EngineeringAssembly Process DevelopmentProcess DevelopmentWafer Scale Processing	2010	28
Residual Stress Analysis in Thin Device Wafer Using Piezoresistive Stress Sensor Aditya Kumar, Xiaowu Zhang, Qing Xin Zhang, IEEE Transactions on Components Packaging and Manufacturing Technology Device WafersEngineeringResidual Stress AnalysisMechanical EngineeringResidual Stress	2011	26
Probabilistic Approach to Life-Cycle Cost Analysis of Preventive Maintenance Strategies on Flexible Pavements John Harvey, Arash Rezaei, Charles Lee Transportation Research Record Journal of the Transportation Research Board Highway PavementEngineeringFlexible PavementsPavement DesignPreventive Maintenance Strategies	2012	25
Evaluation, Selection, and Application of Model-Based Diagnosis Tools and Approaches Scott Poll, Ann Patterson‐Hine, Joe Camisa, AIAA Infotech@Aerospace 2007 Conference and Exhibit EngineeringIntelligent DiagnosticsVerificationDiagnosisSystem Diagnosis	2007	25

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