Journal of materials research/Pratt's guide to venture capital sources · 2013 · 11 citations · 20 references
Natural SciencesMaterials EngineeringMaterials ScienceElectronic MaterialsSemiconductor MaterialsThin FilmsSemiconductor Device MaterialsSemiconductor PhysicsSemiconductor Thin FilmsThermal Properties Of SemiconductorsThin Film Electrical PropertiesThin-film MaterialsElectrical ResistivityElectrical Resistivity ReductionTemperature-dependent ResistivityThermal StabilityThin Film Thermal Transport
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Copper Transport in Thermal SiO2
Yosi Shacham‐Diamand, A. Dedhia, D. Hoffstetter et al. · Journal of The Electrochemical Society · 1993 · 241 citations
On the use of alloying elements for Cu interconnect applications
Katayun Barmak, C. Cabral, K. P. Rodbell et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2006 · 119 citations
Natural Sciences, Materials Engineering, Materials Science +17
Characteristics of TiN barrier layer against Cu diffusion
Mi-Kyung Kwak, D. H. Shin, Tae-Won Kang et al. · Thin Solid Films · 1999 · 86 citations
Natural Sciences, Materials Engineering, Materials Science +14