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Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection

Materials Science3D Ic ArchitectureWafer Scale ProcessingSingle-micron PitchEngineeringFlexible ElectronicsMicrofabricationPlanar StructureAdvanced Packaging (Semiconductors)Mechanical EngineeringApplied PhysicsChip AttachmentElectronic PackagingMicroelectronics3D Printing