Concepedia

Masatsugu Nimura

MN

Statistics

Publications

9

Citations

173

H-Index

9

Active since

2011

Affiliations

Waseda University(Current)

National Institute for Materials Science

Toray Industries, Inc. (Japan)

IBM (United States)

Nissan Chemical Corporation (Japan)

Masatsugu Nimura is an author at Waseda University specializing in materials science, materials engineering, and engineering.

Publications per year

2011–2016

9

Publications

9

High throughput thermal compression NCF bonding

Toshihisa Nonaka, Y. Kobayashi, Noboru Asahi et al. · 2014 · 37 citations

Engineering, Materials Engineering, Materials Science +7

High productivity thermal compression bonding for 3D-IC

Noboru Asahi, Yoshinori Miyamoto, Masatsugu Nimura et al. · 2015 · 32 citations

Engineering, Materials Engineering, Materials Science +12

Vacuum Ultraviolet Irradiation Treatment for Reducing Gold&ndash;Gold Bonding Temperature

Akiko Okada, Shuichi Shoji, Masatsugu Nimura et al. · MATERIALS TRANSACTIONS · 2013 · 22 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Cu-Cu direct bonding technology using ultrasonic vibration for flip-chip interconnection

Yoshiyuki Arai, Masatsugu Nimura, Hajime Tomokage · 2015 · 17 citations

Engineering, Materials Engineering, Materials Science +14

Hybrid Au-Adhesive Bonding Using Planar Adhesive Structure for 3-D LSI

Masatsugu Nimura, Jun Mizuno, Shuichi Shoji et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 15 citations

Engineering, Materials Engineering, Materials Science +13

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