Materials Today Proceedings · 2015 · 49 citations · 12 references
EngineeringElectrical EngineeringMaterials EngineeringMicrofabricationNanomaterialsNanotechnology3D PrintingAerosol ScienceChip PackagingIntegrated Circuit FabricationInterconnect TechnologyMicrofluidic Device FabricationAerosol Particle DepositionElectrical InterconnectsInkjet DepositionInterconnect FabricationOn-chip Interconnects
12
Direct writing technology—Advances and developments
K.K.B. Hon, L. Li, Ian M. Hutchings · CIRP Annals · 2008 · 479 citations
Rao Tummala · IEEE Transactions on Advanced Packaging · 2004 · 271 citations
Engineering, Computer Engineering, Electrical Engineering +17
System-on-Chip: Reuse and Integration
R. Saleh, Steven J. E. Wilton, Shahriar Mirabbasi et al. · Proceedings of the IEEE · 2006 · 264 citations
Tobias Seifert, Enrico Sowade, Frank Roscher et al. · Industrial & Engineering Chemistry Research · 2015 · 259 citations
Natural Sciences, Materials Engineering, Materials Science +11