IEEE Transactions on Electron Devices · 2009 · 40 citations · 10 references
EngineeringElectrical EngineeringHeat TransferMicroelectronicsSemiconductor DevicesDevice ModelingHeat ConductionHeat Transfer AnalysisHeat Transfer ModelingSemiconductor ReliabilityTransient Heat TransferElectro-thermal ModelingElectrothermal SimulationPeriodicityThermal EffectsThermal Transient ResponseTransient Heat Transfer AnalysisTransient Thermal AnalysisTransient Thermal Response
<para xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> Thermal accumulation effects in an LDMOSFET under the impact of a periodic electromagnetic pulse (EMP) are investigated using time-domain finite-element method combined with the preconditioned conjugated gradient technique. The transient thermal response in the LDMOSFET and its peak temperature are captured and compared, with different waveforms of the injected EMP chosen for computation. It is shown that, as the ratio of the pulsewidth and its periodicity increases, thermal accumulation effects on the transient thermal response as well as the peak temperature in LDMOSFETs are observable, which should be treated appropriately in the prediction of its electrothermal breakdown and reliability. </para>
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William A. Radasky, Carl E. Baum, Magnus Wik · IEEE Transactions on Electromagnetic Compatibility · 2004 · 414 citations
Sven Rzepka, Kaustav Banerjee, E. Meusel et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1998 · 118 citations
Engineering, Computer Engineering, Electrical Engineering +17