IEEE Journal of Solid-State Circuits · 1997 · 56 citations · 6 references
EngineeringElectrical EngineeringMemoryMicroelectronicsSemiconductor DevicesCharge-coupled DevicesCmos Circuit DesignMemory DevicesMemory HierarchyMemory Hierarchy DesignMemory Subsystem DesignCharge StorageHigh-dielectric-constant MaterialsMemory CapacityMemory Cell DesignMemory Circuit DesignMemory CircuitsMemory Storage CapacitySense Amplifier Design
A 4-Gb DRAM with multilevel-storage memory cells has been developed. This large memory capacity is achieved by storing data at four levels, each corresponding to two-bit-data storage in a single memory cell. The four-level storage reduces the effective cell size by 50%. A sense amplifier using charge coupling and charge sharing was developed for the four-level sensing and restoring. The sense amplifier uses a hierarchical bit-line scheme and operates in a time-sharing mode, thus reducing the sense amplifier area. A 4-Gb DRAM fabricated using 0.15-/spl mu/m CMOS technology measures 986 mm/sup 2/. The memory cell is 0.23 /spl mu/m/sup 2/. Its capacitance of 60 fF is achieved by using a high-dielectric-constant material BST.
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A 16-level/cell dynamic memory
Masahiro Aoki, Y. Nakagome, Masashi Horiguchi et al. · IEEE Journal of Solid-State Circuits · 1987 · 30 citations
Engineering, Computer Engineering, Computer Architecture +14
A 1 Gb DRAM for file applications
Tadahiko Sugibayashi, I. Naritake, Satoru Utsugi et al. · 2002 · 23 citations
Engineering, Computer Engineering, Electrical Engineering +7
An experimental DRAM with a NAND-structured cell
T. Hasegawa, D. Takashima, Ryu Ogiwara et al. · IEEE Journal of Solid-State Circuits · 1993 · 19 citations
Engineering, Computer Engineering, Electrical Engineering +14