IEEE Transactions on Electron Devices · 2009 · 37 citations · 6 references
EngineeringMaterials EngineeringMaterials ScienceLife Cycle AssessmentMechanical Behavior Of MaterialsStructural MaterialsFailure CriteriaFailure TheoriesFracture MechanicsReliability ModelingSemiconductor ReliabilityStrength Of MaterialsDynamic Reliability AnalysisFatigue LifeFatigue Life AssessmentFatigue Life PredictionFatigue TestingLife PredictionRandom Vibration TestingWeibull Model
The aim of this paper is to provide a systematic method to perform experimental test and theoretical evaluation on fatigue characteristics of plastic-ball-grid-array (PBGA) assembly under random vibration. A specified PBGA assembly which contains different structural and material parameters was manufactured. The fatigue characteristics of PBGA assembly under random vibration were tested. Manson-Coffin empirically derived formula and rain-flow algorithm were used to achieve the fatigue life of solder joints. In the meantime, the failure curve (reliability-cycle number curve) can be obtained by using Weibull distribution method when PBGA assembly is on different working situation. Finally, life prediction of corner solder balls was deduced based on three-band technology and cumulative damage index. Test results lay a basis for high-reliability design of PBGA assembly for engineering application.
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Durability/reliability of BGA solder joints under vibration environment
T. E. Wong, Frederick Palmieri, B.A. Reed et al. · 2002 · 43 citations