IEEE Design & Test of Computers · 2008 · 10 citations · 7 references
EngineeringCommunicationElectrical EngineeringLow-power DesignMicrowave EngineeringWireless CommunicationsImpedance MatchingMixed-signal Integrated Circuit DesignRadio-frequency Integrated CircuitsSignal IntegrityUltra-wideband CommunicationWireless Power TransferBand-pass FiltersPower IntegrityRadio-frequency Integrated Circuit DesignSystem-in-packageSystem-in-package IntegrationTransceiver ArchitecturesWireless Data TransmissionWireless Transmission
This article introduces a low-noise ultrawideband transceiver system-in-package design for a compact implementation in a small mobile platform. In the designed UWB transceiver SiP, the transmitter chip has a fully digital circuit implementation with a band-pass filter, and the receiver chip has a noncoherent architecture. To reduce noise generation and coupling in the densely integrated SiP design, the authors considered signal integrity issues at the high-frequency channel, and power integrity issues at the power distribution network in the SiP substrate. To ensure signal integrity, the authors minimized reflection loss at the high frequency channel through a balanced impedance-matching technique. To secure power integrity, they carefully managed cavity resonance frequencies and the split plane when designing the power-ground plane of the SiP substrate. They have successfully demonstrated 100 Mbps wireless data transmission using the proposed UWB transceiver SiP with a power consumption of 30.4 mW.
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Rao Tummala · IEEE Transactions on Advanced Packaging · 2004 · 271 citations
Engineering, Computer Engineering, Electrical Engineering +17
System on chip or system on package?
Rao Tummala, Vijay K. Madisetti · IEEE Design & Test of Computers · 1999 · 120 citations
Jun So Pak, Hyungsoo Kim, Junwoo Lee et al. · IEEE Transactions on Advanced Packaging · 2007 · 27 citations