Evaluation of mechanical quality of field-assisted diffusion bonding by ultrasonic nondestructive method

Field Assisted Glass-Metal Sealing

George Wallis, D. Pomerantz · Journal of Applied Physics · 1969 · 730 citations

Natural Sciences, Materials Engineering, Materials Science +7

Precision accelerometers with μg resolution

F. Rudolf, A. Jornod, J. Bergqvist et al. · Sensors and Actuators A Physical · 1990 · 116 citations

Engineering, Mechatronics Engineering, Instrumentation +13

A capacitive pressure sensor with low impedance output and active suppression of parasitic effects

Eric Peeters, A. Bossche, Willy Sansen · Sensors and Actuators A Physical · 1990 · 104 citations

Engineering, Bioengineering, Analog Electronics +16

Silicon Wafer Bonding Mechanism for Silicon-on-Insulator Structures

Takao Abé, Tokio Takei, Atsuo Uchiyama et al. · Japanese Journal of Applied Physics · 1990 · 78 citations

Engineering, Materials Engineering, Materials Science +17

Tensile strength characterization of low-temperature fusion-bonded silicon wafers

Bernhard Müller, A Stoffel · Journal of Micromechanics and Microengineering · 1991 · 55 citations

Engineering, Materials Engineering, Materials Science +16