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A Comprehensive Model for Hot Carrier Degradation in LDMOS Transistors
67
Citations
13
References
2007
Year
Unknown Venue
Device ModelingElectrical EngineeringEngineeringHot Carrier DegradationLdmos TransistorsBias Temperature InstabilityInternal Device TemperatureSingle Event EffectsCircuit ReliabilityDevice ReliabilityMicroelectronicsSemiconductor Device
This paper presents a comprehensive yet physical model for hot carrier degradation in LDMOS transistors. The only model input parameters are the gate and drain voltage V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ds</sub> and V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">gs </sub> , the internal device temperature and the device width W. The model allows calculating AC degradation performance out of the DC hot carrier data. A physical explanation of the observed effects is provided, and important differences between LDMOS and standard CMOS are highlighted
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