IEEE Transactions on Microwave Theory and Techniques · 2003 · 85 citations · 23 references
EngineeringElectrical EngineeringMicrofabricationPower ElectronicsSystem-on-chip DesignChip PackagingIntegrated Circuit DesignIntegrated Circuit DevicesIntegrated Circuit FabricationMagnetic ComponentsRadio-frequency Integrated CircuitsInductor DesignInductorsLow-power Wireless CommunicationPlastic Deformation BehaviorPortable Communication DevicesSubstrate ToleranceThree-dimensional IntegrationWireless Communication Systems
On-chip inductors are critical for enabling portable power-efficient wireless communication systems. Existing on-chip spiral inductors based on conventional planar integrated-circuit fabrication technology suffer from substrate loss and parasitics, and have relatively large footprints. In this paper, we discuss the development of two types of on-chip three-dimensional (3-D) inductors-a vertical spiral inductor and a solenoid inductor-by using a 3-D assembly process called plastic deformation magnetic assembly. Prototype vertical spiral inductors and solenoid inductors have been fabricated and tested. Experimental results show that the vertical spiral inductors can achieve better performance and a smaller footprint than the in-plane ones.
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