IEEE Transactions on Electron Devices · 2005 · 58 citations · 23 references
EngineeringElectrical EngineeringMicroelectronicsSemiconductor DevicesSemiconductor MaterialsBipolar Junction TransistorsHigh-frequency Semiconductor DevicesIii-v SemiconductorsMetal-oxide-semiconductor Field-effect TransistorsSemiconductor Device MaterialsSemiconductor HeterostructuresBase ResistanceDoping ProfilesHeterojunction Bipolar TransistorsMaximum GainPower AmplificationPower GainSemiconductor Doping ProfilesSilicon Germanium Bipolar Transistor
The power gain difference, under different device stability conditions, between common-emitter (CE) and common-base (CB) bipolar junction transistors (BJT) is analyzed comprehensively. The analysis reveals that the CB configuration offers higher maximum available power gain than the CE configuration in the device's high operation frequency range, while the inverse relation holds in the very low frequency range. In the intermediate frequency range, the base resistance value, mainly affected by the base doping concentration, determines which configuration offers higher maximum stable power gain (MSG). These analyses have explicit implications on the operation configurations of SiGe heterojunction bipolar transistors (HBTs). Employing a typical doping profile of Si bipolar junction transistors with a trapezoidal Ge profile in SiGe HBTs usually results in a larger base resistance than the emitter resistance. For these devices, the CE configuration exhibits higher MSG than the CB configuration. Employing a higher base doping concentration than the emitter with a box-type Ge profile considerably reduces the base resistance and thus favors the CB configuration for power amplification in this frequency range. The analysis are quantitatively verified with simulation and measurement results from SiGe HBTs of representative Ge and base doping profiles.
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Analysis and Design of Analog Integrated Circuits
W.R. Betts · Electronics and Power · 1978 · 3.8K citations
M.J.W. Rodwell, Miguel Urteaga, T. Mathew et al. · IEEE Transactions on Electron Devices · 2001 · 177 citations