On-chip piezoresistive stress measurement and 3D finite element simulations of plastic DIL 40 packages using different materials

Abstract

A full matrix of 8 different configurations of a plastic DIL 40 package has been measured. The materials used in the package consisted of a copper or an alloy 42 lead frame, a standard conductive die-attach adhesive or a special low stress type of die-attach adhesive and a standard moulding compound or a low stress compound. The stress measurements were performed with a test chip based on the piezoresistive effect. The numerical simulations ham been carried out to verify the results and to gain more insight in the deformations inside the package. Though the results are achieved for an dual in line package some results will also be valid for other types of plastic packages. >