Stress distributions and thin film mechanical properties

Abstract

Abstract Non‐uniform stresses exist near the edges of thin films as a result of satisfying the boundary conditions. Growth stresses also contribute to stress gradients within the film, especially in structures with a void‐columnar microstructure. As a result the strain‐sensitive properties also must show spatial variations which will become more important as the specimen size decreases. We examine the origin of these distributions within the limits of elestic behavior, and discuss cases for which the distributions have also been measured. The role of plastic deformation in relaxation and fracture is introduced.