Damage mechanisms in impact-ionization-induced mixed-mode reliability degradation of SiGe HBTs

Abstract

A robust, time-dependent methodology is used to investigate impact-ionization-induced mixed-mode reliability stress (the simultaneous application of high J/sub E/ and high V/sub CB/) in advanced SiGe HBTs. We present comprehensive stress data on second-generation 120-GHz SiGe HBTs, and use specially designed test structures with variable emitter-to-shallow trench spacing to shed light on the resultant damage mechanisms. We also explore the impact of mixed-mode stress on low frequency noise, ac performance, high-temperature device characteristics, and employ two-dimensional calibrated MEDICI simulations using the hot carrier injection current technique to better understand the physical damage locations.