Stress relaxation during isothermal annealing in electroplated Cu films

Mechanisms for microstructure evolution in electroplated copper thin films near room temperature

J. M. E. Harper, C. Cabral, P. C. Andricacos et al. · Journal of Applied Physics · 1999 · 359 citations

Natural Sciences, Materials Engineering, Materials Science +17

Thermal strain and stress in copper thin films

Richard P. Vinci, E. M. Zielinski, J. C. Bravman · Thin Solid Films · 1995 · 264 citations

Natural Sciences, Materials Engineering, Materials Science +17

Grain boundary self-diffusion in Cu polycrystals of different purity

T. Surholt, Chr. Herzig · Acta Materialia · 1997 · 243 citations

Natural Sciences, Materials Engineering, Materials Science +16

Isothermal stress relaxation in electroplated Cu films. I. Mass transport measurements

Dongwen Gan, Paul S. Ho, Rui Huang et al. · Journal of Applied Physics · 2005 · 72 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Diffusion creep of a thin foil

G. B. Gibbs · Philosophical magazine · 1966 · 68 citations

Natural Sciences, Materials Engineering, Materials Science +13