Effect of autoclave test on anisotropic conductive joints

The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging

E.H. Wong, K.C. Chan, R. Rajoo et al. · 2002 · 145 citations

Engineering, Mechanical Engineering, Hygroscopic Swelling +20

Corrosion study at Cu–Al interface in microelectronics packaging

C.W. Tan, A. R. Daud, Mohd Ambar Yarmo · Applied Surface Science · 2002 · 96 citations

Materials Science, Corrosion Technology, Engineering +4

Conduction mechanisms in anisotropic conducting adhesive assembly

C.N. Oguibe, S.H. Mannan, D.C. Whalley et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1998 · 49 citations

Engineering, Mechanical Engineering, Thermal Conductivity +19

Degradation mechanisms of anisotropic conductive adhesive joints for flip chip on flex applications

Y.C. Chan, K.C. Hung, Chengcheng Tang et al. · 2002 · 28 citations

Engineering, Mechanical Engineering, Flip Chip +19

Anisotropic conductive adhesive films for flip-chip interconnection onto organic substrates

Atsushi Nagai, Kentaro Takemura, Kazuhiro Isaka et al. · 2002 · 21 citations

Engineering, Organic Electronics, Acf Adhesive Resin +18