Concepedia

N.H. Yeung

NY

6

Publications

141

Citations

6

H-Index

2001

Active since

Affiliations

City University of Hong Kong(Current)

Chalmers University of Technology

N.H. Yeung is an author at City University of Hong Kong specializing in engineering, materials science, and mechanical engineering.

Top concepts

EngineeringMaterial ScienceMechanical EngineeringMechanics Of MaterialsSolid MechanicsMicrofabricationElectronic PackagingElectrical EngineeringMechanicsMicroelectronics

Publications per year

2001–2005

6

Publications

6

The effects of bump height on the reliability of ACF in flip‐chip

Chi‐Man Lawrence Wu, Johan Liu, N.H. Yeung · Soldering and Surface Mount Technology · 2001 · 39 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +16

Behaviour of anisotropic conductive joints under mechanical loading

C.W. Tan, Y.C. Chan, N.H. Yeung · Microelectronics Reliability · 2003 · 36 citations

Materials Science, Engineering, Mechanical Behavior +6

Effect of autoclave test on anisotropic conductive joints

C.W. Tan, Y.C. Chan, N.H. Yeung · Microelectronics Reliability · 2003 · 30 citations

Materials Science, Engineering, Durability Performance +3

Effect of Bonding Force on the Conducting Particle With Different Sizes

N.H. Yeung, Y.C. Chan, C.W. Tan · Journal of Electronic Packaging · 2003 · 15 citations

Engineering, Mechanical Engineering, Thermal Conductivity +26

Modelling the effect of voids in anisotropic conductive adhesive joints

K.K. Lee, N.H. Yeung, Y.C. Chan · Soldering and Surface Mount Technology · 2005 · 11 citations

Engineering, Mechanical Engineering, Flip Chip +18

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