2002 · 17 citations · 0 references
EngineeringElectrical EngineeringMaterials EngineeringCeramic MaterialsElectronic MaterialsMicroelectronicsChip PackagingDevice ReliabilityIntegrated Circuit DesignMixed-signal IntegrationThermal DesignThermal Properties Of CeramicsCeramic Material PropertiesCeramic PackagingChip-scale PackagingHigh PerformanceHigh-temperature Thermal PropertiesPackage ReliabilityThermal Expansion CoefficientThermal Expansion In Ceramics
Needs for the Chip Scale Package (CSP) is acceleratingly increased in the package market, where low cost, light weight, smaller, and thinner package is required. The increasing signal performance and number of functions of a signal processing system also require higher pin count and higher wiring density. To satisfy these needs, we have developed a high thermal coefficient of expansion (TCE) ceramic material, HITCE. This material enables a fine and flexible design of a package for high performance, and high reliability.