Statistics
Publications
5
Citations
150
H-Index
5
Active since
2002
Affiliations
Shizuoka University(Current)
M. Higashi is an author at Shizuoka University specializing in engineering, electrical engineering, and chip packaging.
Publications per year
2002–2007
5
5
Extremely Low Keff (1.9) Cu Interconnects with Air Gap Formed Using SiOC
Takeshi Harada, Akira Ueki, Kazuo Tomita et al. · 2007 · 15 citations
Development of interconnect technologies for embedded organic packages
Masahiro Sunohara, Kei Murayama, M. Higashi et al. · 2004 · 14 citations
Engineering, Manufacturing Engineering, Materials Science +17
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