Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads

Lead-free Solders in Microelectronics

Mulugeta Abtew, Guna S Selvaduray · Materials Science and Engineering R Reports · 2000 · 2K citations

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Single-wall carbon nanotube (SWCNT) functionalized Sn–Ag–Cu lead-free composite solders

V. Kripesh, A.A.O. Tay · Journal of Alloys and Compounds · 2006 · 167 citations

Natural Sciences, Materials Engineering, Materials Science +11

Dissolution and interfacial reactions of thin-film Ti/Ni/Ag metallizations in solder joints

Gautam Ghosh · Acta Materialia · 2001 · 163 citations

Natural Sciences, Materials Engineering, Materials Science +14

Ductile-to-brittle transition in Sn–Zn solder joints measured by impact test

Munehiro Date, T. Shoji, M. Fujiyoshi et al. · Scripta Materialia · 2004 · 162 citations

Natural Sciences, Materials Engineering, Materials Science +16

Sn–0.7wt.%Cu/Ni interfacial reactions at 250°C

Chunqing Wang, Sheng Chen · Acta Materialia · 2005 · 130 citations

Natural Sciences, Materials Engineering, Materials Science +9