Publication | Closed Access

Low-Temperature, Strong SiO2-SiO2 Covalent Wafer Bonding for III–V Compound Semiconductors-to-Silicon Photonic Integrated Circuits

SemiconductorsPhotonicsElectrical EngineeringWafer Scale ProcessingEngineeringDevice IntegrationIntegrated PhotonicsApplied PhysicsOptoelectronic DevicesIntegrated CircuitsPhotonic Integrated CircuitPhotonic DeviceOptoelectronicsSilicon Photonics