Low-Temperature, Strong SiO2-SiO2 Covalent Wafer Bonding for III–V Compound Semiconductors-to-Silicon Photonic Integrated Circuits

Di Liang, Alexander W. Fang, Hyundai Park, T.E. Reynolds, K. Warner, Douglas C. Oakley, John E. Bowers

Journal of Electronic Materials · 2008 · 96 citations · 27 references

Concepts

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