K. Warner

A wafer-scale 3-D circuit integration technology

J.A. Burns, Brian F. Aull, C.K. Chen et al. · IEEE Transactions on Electron Devices · 2006 · 265 citations

3D Ic Architecture, Electrical Engineering, Wafer Scale Processing +15

Three-dimensional integrated circuits for low-power, high-bandwidth systems on a chip

J.A. Burns, L.G. McIlrath, C.L. Keast et al. · 2002 · 162 citations

Engineering, Vlsi Design, Computer Architecture +20

Megapixel CMOS image sensor fabricated in three-dimensional integrated circuit technology

Vyshnavi Suntharalingam, R. Berger, J.A. Burns et al. · 2005 · 122 citations

Room Temperature, Electrical Engineering, 3D Ic Architecture +14

Low-Temperature, Strong SiO2-SiO2 Covalent Wafer Bonding for III–V Compound Semiconductors-to-Silicon Photonic Integrated Circuits

Di Liang, Alexander W. Fang, Hyundai Park et al. · Journal of Electronic Materials · 2008 · 94 citations

Semiconductors, Photonics, Electrical Engineering +11

A Study of Crosstalk in a <inline-formula> <tex-math notation="LaTeX">$256 \times 256$ </tex-math></inline-formula> Photon Counting Imager Based on Silicon Geiger-Mode Avalanche Photodiodes

Brian F. Aull, Daniel R. Schuette, Douglas Young et al. · IEEE Sensors Journal · 2014 · 61 citations

Engineering, Photon Counting Imager, Integrated Circuits +17