K. Warner

A wafer-scale 3-D circuit integration technology

J.A. Burns, Brian F. Aull, C.K. Chen et al. · IEEE Transactions on Electron Devices · 2006 · 269 citations

Engineering, Electrical Engineering, Analog Electronics +16

Three-dimensional integrated circuits for low-power, high-bandwidth systems on a chip

J.A. Burns, L.G. McIlrath, C.L. Keast et al. · 2002 · 165 citations

Engineering, Computer Engineering, Electrical Engineering +17

Megapixel CMOS image sensor fabricated in three-dimensional integrated circuit technology

Vyshnavi Suntharalingam, R. Berger, J.A. Burns et al. · 2005 · 122 citations

Engineering, Electrical Engineering, Microelectronics +16

Low-Temperature, Strong SiO2-SiO2 Covalent Wafer Bonding for III–V Compound Semiconductors-to-Silicon Photonic Integrated Circuits

Di Liang, Alexander W. Fang, Hyundai Park et al. · Journal of Electronic Materials · 2008 · 96 citations

Engineering, Materials Engineering, Materials Science +12

A Study of Crosstalk in a <inline-formula> <tex-math notation="LaTeX">$256 \times 256$ </tex-math></inline-formula> Photon Counting Imager Based on Silicon Geiger-Mode Avalanche Photodiodes

Brian F. Aull, Daniel R. Schuette, Douglas Young et al. · IEEE Sensors Journal · 2014 · 61 citations

Engineering, Electrical Engineering, Optoelectronics +16