T.E. Reynolds

A 45nm Logic Technology with High-k+Metal Gate Transistors, Strained Silicon, 9 Cu Interconnect Layers, 193nm Dry Patterning, and 100% Pb-free Packaging

K. Mistry, R. Chau, Changhwan Choi et al. · 2007 · 825 citations

Nm Logic Technology, Engineering, Vlsi Design +18

A 22nm high performance and low-power CMOS technology featuring fully-depleted tri-gate transistors, self-aligned contacts and high density MIM capacitors

C. Auth, C. Allen, A. Blattner et al. · 2012 · 749 citations

Low-power Cmos Technology, Engineering, Vlsi Design +19

Travelling-wave photodetectors with 172-GHz bandwidth and 76-GHz bandwidth-efficiency product

K. Giboney, Radhakrishnan Nagarajan, T.E. Reynolds et al. · IEEE Photonics Technology Letters · 1995 · 122 citations

Photonics, Electrical Engineering, First Fabrication +15

Low threshold, wafer fused long wavelength vertical cavity lasers

J.J. Dudley, D.I. Babic, Richard P. Mirin et al. · Applied Physics Letters · 1994 · 118 citations

Vertical Cavity Lasers, Photonics, Electrical Engineering +12

Low-Temperature, Strong SiO2-SiO2 Covalent Wafer Bonding for III–V Compound Semiconductors-to-Silicon Photonic Integrated Circuits

Di Liang, Alexander W. Fang, Hyundai Park et al. · Journal of Electronic Materials · 2008 · 94 citations

Semiconductors, Photonics, Electrical Engineering +11