Effect of Ag addition in Sn on growth of SnTe compound during reaction between molten solder and tellurium

Thermochemical data of pure substances

Choice Reviews Online · 1993 · 4.5K citations

Natural Sciences, Biochemistry, Chemistry +14

Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

H. K. Kim, K. N. Tu · Physical review. B, Condensed matter · 1996 · 501 citations

Engineering, Materials Engineering, Materials Science +14

Three-dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu

H. K. Kim, H. K. Liou, K. N. Tu · Applied Physics Letters · 1995 · 193 citations

Natural Sciences, Materials Engineering, Materials Science +17

Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders

Mingliang Huang, T. Loeher, Andreas Ostmann et al. · Applied Physics Letters · 2005 · 91 citations

Engineering, Materials Engineering, Materials Science +17

The Ag-Te (Silver-Tellurium) System

İshak Karakaya, W. T. Thompson · Journal of Phase Equilibria · 1991 · 76 citations

Natural Sciences, Materials Science, Physics +6