High-Temperature RF Probe Station for Device Characterization Through 500<tex>$^circ$</tex>C and 50 GHz

Z.D. Schwartz, Alan N. Downey, Samuel A. Alterovitz, George E. Ponchak

IEEE Transactions on Instrumentation and Measurement · 2005 · 41 citations · 6 references

Concepts

TL;DR

The probe station uses a ceramic heater mounted on NASA Shuttle tile, controlled via a GUI‑based feedback loop, to enable on‑wafer microwave testing of devices from room temperature to >500 °C with a VNA measuring 1–50 GHz S‑parameters while shielding probes, cables, and the microscope from heat. The system successfully performed on‑wafer microwave testing of gold transmission lines on silicon carbide up to 540 °C, demonstrating its capability for high‑temperature device characterization.

Abstract

A high-temperature measurement system capable of performing on-wafer microwave testing of semiconductor devices has been developed. This high-temperature probe station can characterize active and passive devices and circuits at temperatures ranging from room temperature to above 500/spl deg/C. The heating system uses a ceramic heater mounted on an insulating block of NASA Shuttle tile. The temperature is adjusted by a graphical computer interface and is controlled by the software-based feedback loop. The system is used with a vector network analyzer to measure scattering parameters over a frequency range from 1 to 50 GHz. The microwave probes, cables, and inspection microscope are all shielded to protect from heat damage. The high-temperature probe station has been successfully used to characterize gold transmission lines on silicon carbide at temperatures up to 540/spl deg/C.

References

6