2002 · 13 citations · 5 references
EngineeringElectrical EngineeringMicroelectronicsMicrowave EngineeringSemiconductor DevicesComplementary Metal-oxide-semiconductor TechnologyHigh-frequency Semiconductor DevicesIntegrated Circuit DesignLow-noise Circuit DesignMicrowave Integrated CircuitsNoise In Analog CircuitsLayout Techniques For Noise ReductionLow-noise DesignNoise FigureNoise Figure AnalysisNoise Figure OptimizationNoise In High-frequency Semiconductor DevicesSubstrate CouplingSubstrate Effects
At high frequencies, substrate effects significantly degrade gain and noise figure of LNAs. A new bond-pad structure presented here significantly reduces substrate effects in a 4.4 GHz LNA resulting in a 10 dB increase in gain and a better than 2 dB improvement in noise figure. The inter-pad isolation of the new bond-pad structure is as much as 30 dB better than that of the conventional bond-pads.
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