Publication | Closed Access
Modeling substrate effects in the design of high-speed Si-bipolar ICs
92
Citations
9
References
1996
Year
EngineeringVlsi DesignPower ElectronicsSilicon On InsulatorInterconnect (Integrated Circuits)Electromagnetic CompatibilityPhysical Design (Electronics)Rf SemiconductorNanoelectronicsMixed-signal Integrated CircuitElectronic PackagingElectronic CircuitElectrical EngineeringHigh-frequency DeviceComputer EngineeringSubstrate EffectsSemiconductor Device FabricationMicroelectronicsCircuit PerformanceBond PadsStandard Circuit SimulatorsApplied Physics
In the design of high-speed IC's, the influence of the substrate on circuit performance must be considered carefully. Therefore, in this paper the contribution of the p/sup -/ substrate and channel stopper to the equivalent circuits of Si-bipolar transistors and bond pads are theoretically and experimentally investigated up to very high frequencies. Improved equivalent substrate circuits, well suited for standard circuit simulators (e,g., SPICE), are derived and checked by numerical simulation using a new simulator (called SUSI). The validity of both the numerical simulation results and the equivalent circuits are verified by on-wafer measurements up to 20 GHz. Finally, the simulator was successfully applied to investigate noise coupling via the substrate.
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