2003 · 14 citations · 3 references
EngineeringComputer EngineeringElectrical EngineeringComputational ElectromagneticsMicroelectronicsMicrowave EngineeringFrequency ResponseFrequency-domain AnalysisMicrowave Device SimulationMicrowave MeasurementsMicrowave Network AnalysisMicrowave PackagingHigh-frequency ModelingMicrowave ModelingPackage ModelingPackage ParasiticsRadio-frequency PackagingS-parameter ModelingSkin Effect LossesSystem-in-package
This paper discusses a simple and efficient method for computing the frequency response of a plane pair stack-up in multi-layered packages and boards. This method is suitable for high speed digital systems where the skin effect approximation is valid. The results have been compared to S-parameter measurements and show good correlation in the frequency range 50 MHz-1 GHz. The effects of decoupling capacitors on the frequency response have also been computed.
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Glen W. Davidson, Danell Crase · Death Studies · 1989 · 2.9K citations
Accurate power supply and ground plane pair models
Hengtian Wu, Jeff Meyer, K. Lee et al. · 2002 · 25 citations