Co-Modeling and Co-Simulation of Package and On-Chip Decoupling Capacitor for Resonant Free Power/Ground Network Design

Abstract

The co-modeling and co-simulation results about the package and on-chip power/ground network have been demonstrated. The inevitable parallel resonance peak, due to the inductive parasitic on the package and on-chip decoupling capacitor, was analyzed in frequency domain. Subsequently, the co-design procedure for the resonant free power/ground network was suggested and evaluated simply in frequency domain.