Concepedia

On-chip Decoupling

On-Chip Decoupling is an integrated circuit design technique that belongs to the class of power integrity management methods, distinguished by its implementation of localized capacitance elements directly within the semiconductor die to suppress supply voltage fluctuations and minimize noise coupling between analog and digital subsystems.

122

Publications

6K

Citations

439

Authors

93

Institutions

Publications per year

2017–2026

11

Parents

Publications

122

Computer-optimized decoupling scheme for wideband applications and low-level operation

A.J. Shaka, Peter B. Barker, Ray Freeman · Journal of Magnetic Resonance (1969) · 1985 · 1.1K citations

, , +14

Power supply noise analysis methodology for deep-submicron VLSI chip design

Howard H. Chen, David D. Ling · 1997 · 319 citations · Full text

, , +17

Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation

Tzong‐Lin Wu, Hao-Hsiang Chuang, Ting-Kuang Wang · IEEE Transactions on Electromagnetic Compatibility · 2010 · 206 citations

, , +15

FlexiShare: Channel sharing for an energy-efficient nanophotonic crossbar

Yan Pan, John Kim, Gokhan Memik · 2010 · 192 citations

, , +17

Power Supply Noise Analysis Methodology For Deep-submicron Vlsi Chip Design

HoChung Chen, D.D. Ling · Proceedings of the 34th Design Automation Conference · 2005 · 187 citations

, , +17

1–5 of 122

Authors

439

  1. EG
    Eby G. Friedman

    University of Rochester, United States

    10 publications · 285 citations

    10

    h-index

  2. JK
    Joungho Kim

    Korea Advanced Institute of Science and Technology, South Korea

    7 publications · 194 citations

    7

    h-index

  3. MP
    Mikhail Popovich

    University of Rochester, United States

    7 publications · 191 citations

    7

    h-index

  4. SX
    Sheldon X.-D. Tan

    University of California, Riverside, United States

    6 publications · 150 citations

    6

    h-index

  5. YC
    Yici Cai

    Tsinghua University, China

    5 publications · 123 citations

    5

    h-index

1–5 of 439

Institutions

93

  1. IBM (United States)

    Armonk, United States

    11 h-index

    48 publications

    2.5K citations

  2. University of Rochester

    Rochester, United States

    11 h-index

    19 publications

    491 citations

  3. Korea Advanced Institute of Science and Technology

    Daejeon, South Korea

    8 h-index

    40 publications

    1.4K citations

  4. Intel (United States)

    Santa Clara, United States

    7 h-index

    30 publications

    2.3K citations

  5. Georgia Institute of Technology

    Atlanta, United States

    7 h-index

    17 publications

    496 citations

  6. University of California, Riverside

    Riverside, United States

    6 h-index

    12 publications

    294 citations

  7. Tsinghua University

    Beijing, China

    6 h-index

    23 publications

    588 citations

  8. IBM Research - Thomas J. Watson Research Center

    Yorktown Heights, United States

    5 h-index

    14 publications

    1.8K citations

1–8 of 93

Venues

  1. IEEE Journal of Solid-State Circuits

    9 publications · 461 citations

    9

    h-index

  2. 9

    h-index

  3. IEEE Transactions on Advanced Packaging

    3 publications · 92 citations

    3

    h-index

  4. 3

    h-index

  5. IEEE Transactions on Power Electronics

    2 publications · 241 citations

    2

    h-index

1–5